| 基材 Base material
|
Polyimide film : 20um, 25um, 40um(Under Development)
Copper thickness(including) : 35um, 18um, 12um, 9um |
| 表面材料车Cover material
|
Polyimide film : 12.5um, 25um, 35um
Photo sensitive cover coat : over 10um |
| Via/Land |
Through hole plating : 100/300um |
| 表面处理 Surface treatment
|
Gold plating(Ni_Au, Au), Sn plating, OSP |
|
|
